An interesting course specially designed for PCB design engineers, hardware/firmware designers, electronic equipment developers, students and researchers. The course will be delivered through a series of lectures, case studies, and hands-on software workshops. Projects include hands on PCB layout/mounting design exercise, 3D design and modeling of an electronic equipment including PCBs & connectors and mobile phone drop impact analysis.

Course Coverage:

  • Harnessing basic mechanical engineering principles and techniques into electronic products’ design and analysis process
  • Present the basic knowledge at three levels:
    • EEE Components
    • Printed Circuit Boards (PCBs)
    • Assembled Equipment
  • Learn PCB layout and designing aspects like critical component placement, mechanical outline control and heat dissipation mechanisms
  • Create finite element simulation to study and analyze behavior of electronic equipments and PCBs for thermal, vibration and shock induced loads
  • Know-how development about commonly used metallic and non-metallic materials for Printed Circuit Boards (PCBs) and Enclosures
  • Introduce best design practices and thumb rules for efficient and robust design

Instructor Profile:
Instructor is foreign qualified with 8 plus years of hands-on work experience in design and development of electronic equipments (Power, RF and Digital) from conception to production for a wide range of applications.

Learning Outcome:
Trainees are expected to learn:

  • Methodologies that are essential to design and analyze printed circuit boards (PCBs) and their mounting in different types of enclosures keeping in view volume, mass and operating environmental constraints
  • Design verification techniques using analytical methods and creating finite element models to perform structural and thermal analysis of the PCBs and assembled equipments to
    • Predict temperature and heat flux distribution on boards and enclosure and identify localized hot-spots
    • Identify thermal hardware and heat sink requirements to maintain EEE components and PCBs within operating temperature limits
    • Calculate board displacements, natural frequencies, mechanical/thermal stresses and estimate components fatigue life due to shock and vibrations
  • Best industry practices for conceptual and detailed designing, thermal management, material selection, and vibration damping to produce efficient and robust designs